Reliability of a Series-Parallel System of Thermionic Diodes,

Abstract

The paper presents a method of predicting the reliability of a series-parallel system of N thermionic diodes. In certain applications it is considered desirable to maintain a constant system power output regardless of changes in system operating conditions. When one component fails, surviving components heat up and individually assume a greater portion of the total power output. Increased thermal stress is thereby placed upon each component and failure, which is assumed proportional to both time and temperature of operation, is seen to occur at an increased rate. A method of predicting such parameters as number of remaining diodes, system temperature, and mean time to next failure is presented. Also included are suggestions for further research. (Author)

Document Details

Document Type
Technical Report
Publication Date
Jul 01, 1971
Accession Number
AD0761015

Entities

People

  • John J. Gassner Jr

Organizations

  • United States Army Materiel Command

Tags

DTIC Thesaurus Topics

  • Reliability
  • Stresses
  • Thermal Stresses

Readers

  • Plasma Physics.
  • Regression Analysis.
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