Millimeter Wave Image Conversion Panels.

Abstract

P SEMICONDUCTOR IMAGE DISSECTING PANELS FOR MM WAVE IMAGING IS DESCRIBED. A description is given of a new mechanical assembly design that will simplify the construction of these panels. This design uses a polystyrene lens as the basic supporting structure on which the preassembled and pretested panel elements are mounted. Diode development work is also described. It has led to diodes in which the bulk resistivity can be changed from 3000 ohms-cm to about 5 ohms-cm by the application of a forward bias of 0.5 A/sq cm. These p-i-n diodes have an Al-alloy p+ region and an As-ion implanted n+ region with Pt-Si-Ti-Pt-Au for contacting metallization. They are capable of providing > 30 db rf modulation in image conversion panel applications. (Author)

Document Details

Document Type
Technical Report
Publication Date
Feb 01, 1973
Accession Number
AD0762116

Entities

People

  • D. A. Kiewit
  • J. M. Baird

Organizations

  • HRL Laboratories

Tags

DTIC Thesaurus Topics

  • Assembly
  • Compound Semiconductors
  • Construction
  • Conversion
  • Dielectric Polymers
  • Electronics
  • Millimeter Waves
  • Modulation
  • Polystyrenes
  • Semiconductors
  • Solid State Electronics

Readers

  • Electronics Engineering
  • Semiconductor Device Technology
  • Software Engineering

Technology Areas

  • 5G
  • Microelectronics