Packaging Precision Quartz Crystal Resonators.

Abstract

RESONATORS ARE REVIEWED WITH EMPHASIS ON THOSE ASPECTS WHICH CAN BE INFLUENCED BY THE RESONATOR'S PACKAGING. A microcircuit compatible ceramic package design is proposed which is aimed toward optimizing the performance of quartz resonators. The package consists of a frame with a top and a bottom lid. The crystals are mounted in metal clips which are initially highly flexible. After mounting, the clips are strengthened as necessary by electroplating. The package parts can be baked at high temperatures, and are hermetically sealable in ultrahigh vacuum, at room temperature, without the use of large forces. The sealing process relies on the adhesion between atomically clean surfaces. The package is adaptable to sealing in inert atmospheres by alternate techniques. (Author)

Document Details

Document Type
Technical Report
Publication Date
Jul 01, 1973
Accession Number
AD0763215

Entities

People

  • Erich Hafner
  • John R. Vig

Organizations

  • United States Army Communications-Electronics Command

Tags

Communities of Interest

  • Materials and Manufacturing Processes

DTIC Thesaurus Topics

  • Adhesion
  • Atmospheres
  • Controlled Atmospheres
  • Deposition (Materials Processing)
  • Electroplating
  • High Temperature
  • Microcircuits
  • Packaging
  • Precision
  • Quartz Resonators
  • Resonators
  • Ultrahigh Vacuum
  • Vacuum

Readers

  • Electrical Engineering
  • Software Engineering
  • Thermal Physics or Thermal Science.

Technology Areas

  • Microelectronics
  • Microelectronics - Graphene
  • Microelectronics - Microelectromechanical Systems