Conduction Mechanisms in Thick Film Microcircuits

Abstract

The solubility of RuO2 in 63% PbO-25% B2O3-12% SiO2 glass has been determined as a function of temperature, both for the equilibrium case and for times typically associated with thick film resistor firing. Studies with the hot stage metallograph have demonstrated the feasibility of obtaining quantitative sintering data with this experimental tool, and have shown the release of gas bubbles from resistors for unexpectedly long periods of time at normal firing temperatures. Possible sources of the escaping gas and the implication as regards the sintering model are discussed. Resistor firing studies have demonstrated that the microstructure formation can be successfully slowed by lower temperature operation while still developing the identical ultimate structure. Studies of resistance during the microstructure development process have led to the conclusion that two different charge transport mechanisms may occur during the firing sequence, and that the relative contributions of these two mechanisms depend upon the particle size and particle size distribution of the conductive phase, as well as the degree of dispersion of the formulation.

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Document Details

Document Type
Technical Report
Publication Date
Aug 01, 1973
Accession Number
AD0765833

Entities

People

  • R. W. Vest

Organizations

  • Purdue Research Foundation

Tags

Communities of Interest

  • Energy and Power Technologies
  • Space

DTIC Thesaurus Topics

  • Coefficients
  • Crystal Structure
  • Dispersions
  • Electrical Properties
  • Fabrication
  • Film Resistors
  • Films
  • Fixed Resistors
  • Materials
  • Materials Processing
  • Measurement
  • Particle Size
  • Particles
  • Resistors
  • Standards
  • Thermal Expansion
  • Thick Films

Readers

  • Rocket Propulsion.
  • Theoretical Analysis.
  • Thin Film Deposition Science.

Technology Areas

  • Microelectronics
  • Microelectronics - Graphene