Effect of Ionizing Radiation on Physical and Chemical Properties of Fiberboard and Paperboard

Abstract

In a large-scale production of prepackaged radappertized (irradiation sterilized) foods there are advantages in performing the irradiation of filled metal cans or flexible packages while stacked in fiberboard or paperboard shipping containers. This study was performed to determine the effect of electron and gamma radiation on the physical and chemical properties and functional performance of the fiberboard and paperboard materials that are used in the packing of cans and flexible packages of radappertized foods. Electron and gamma radiation caused significant physical and chemical changes in the fiberboard and paperboard materials. Physical property values (puncture, burst, tear, tensile) decreased with increasing radiation dose (1, 3, and 6 megarads) and increasing irradiation temperature (-80 C, - 30 C, and 21 C). Whereas the component testing of fiberboard and paperboard and laboratory drop tests of fiberboard containers indicated that irradiation at a food-sterilization dosage level caused marked reductions in performance of the materials and containers made therefrom, these changes were not great enough to seriously impair the functional performance of the fiberboard and paperboard containers for packing of cans or packages of food during irradiation processing and subsequent shipment and storage.

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Document Details

Document Type
Technical Report
Publication Date
Oct 01, 1972
Accession Number
AD0767250

Entities

People

  • John J. Killoran
  • Peter T. Burke
  • Sheo Ram Agarwal

Organizations

  • United States Army Soldier Systems Center

Tags

DTIC Thesaurus Topics

  • Bursting Strength
  • Chemical Properties
  • Chemistry
  • Dose Rate
  • Drop Tests
  • Gamma Rays
  • Hydrogen
  • Ionizing Radiation
  • Materials
  • Molecular Weight
  • Paperboard
  • Physical Properties
  • Polymers
  • Radiation
  • Shipping Containers
  • Software Testing
  • Tensile Strength

Readers

  • Gender and Food Studies
  • Materials Science
  • Nuclear and Radiation Engineering.

Technology Areas

  • Microelectronics