Chip and Wire Assembly and Packaging Facilities for Prototype Microelectronic Integrated Circuits,

Abstract

The goal of the report is to provide a realistic and comprehensive cost estimate for two microelectronic chip and wire assembly and final packaging facilities for prototype microelectronic hybrid integrated circuits. An analysis is made of typical costs that should be anticipated for the initial installation, operation, and staffing of chip and wire assembly and packaging facilities. (Modified author abstract)

Document Details

Document Type
Technical Report
Publication Date
Jul 01, 1971
Accession Number
AD0768142

Entities

People

  • James H. Donnelly

Organizations

  • United States Army Materiel Command

Tags

Communities of Interest

  • Advanced Electronics

DTIC Thesaurus Topics

  • Abstracts
  • Assembly
  • Circuits
  • Cost Estimates
  • Costs
  • Integrated Circuits
  • Packaging
  • Prototypes

Fields of Study

  • Engineering

Readers

  • Integrated Circuit Design and Technology.
  • Life Cycle Cost Analysis

Technology Areas

  • Microelectronics