Study of Contemporary Electronic Components under a Fluid-Pressure Environment

Abstract

The effects of a high fluid pressure environment on electronic components was examined with emphasis on semiconductor devices including integrated circuits. The impetus for this study has been the possible application of electronic systems in the deep ocean without protection from the large hydrostatic pressure of that environment. The effects of both the fluid and the pressure on components immersed in oil at pressures up to 15,000 psi have been considered theoretically, with experimental verification when possible. It is concluded that structurally homogeneous electronic materials such as silicon and germanium will not be affected by the high pressures. Pressure hardening techniques involving free flooding and component structure design are described. (Modified author abstract) Portions of this document are not fully legible.

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Document Details

Document Type
Technical Report
Publication Date
Mar 01, 1973
Accession Number
AD0769980

Entities

People

  • J. J. Wortman
  • J. W. Harrison

Organizations

  • RTI International

Tags

Communities of Interest

  • Advanced Electronics

DTIC Thesaurus Topics

  • Bipolar Junction Transistors
  • Crystal Structure
  • Electronics Laboratories
  • Energy Bands
  • Failure Mode And Effect Analysis
  • Material Degradation Processes
  • Materials Laboratories
  • Materials Processing
  • Materials Testing
  • Mechanical Working
  • Mechanics
  • Modules (Electronics)
  • Modulus Of Elasticity
  • Power Electronics
  • Semiconductor Devices
  • Semiconductors
  • Spin-Orbit Interaction

Readers

  • Mechanical Engineering/Mechanics of Materials.
  • Structural Dynamics.
  • Systems Analysis and Design

Technology Areas

  • Microelectronics