Fatigue Crack Growth in Ti-6Al-4V from Threshold to Unstable Fracture,
Abstract
The fatigue crack growth of Ti-6Al-4V in the diffusion bond annealed condition was examined in the range of growth rates from 10 to the minus 12th power to 10 to the minus 4th power m/cycle with the use of compact tension and part-through-crack specimens. The effects of cyclic frequency and maximum stress were investigated. Fractured surfaces were examined by scanning electron microscopy over the entire range of crack growth. The fatigue data were fit empirically to a number of crack propagation laws, none of which was able to predict the entire range of crack growth from threshold to unstable fracture. When the fatigue crack growth rates were compared with those of Ti-6Al-4V of other microstructures, it was found that the diffusion bond annealed was among the most fatigue crack resistant of any microstructure examined. (Author)
Document Details
- Document Type
- Technical Report
- Publication Date
- Nov 30, 1973
- Accession Number
- AD0770980
Entities
People
- E. George Kendall
- Maurice F. Amateau
- William D. Hanna
Organizations
- The Aerospace Corporation