Wafer Gun Propellant
Abstract
The wafer fun propellant studied in this program is a composite solid propellant with a moldable binder. It contains the cyclic nitramine, HMX, for an oxidizer and has the advantages of high impetus, relatively low flame temperature, and a manufacturing process adaptable to high volume production with good producibility. The wafer gun propellant is punch-pressed from a dry powder into a disc or wafer with nearly neutral burning characteristics. It is then oven cured. The wafer configuration permits an easily varied burning web, since the pressed wafer thickness is a variable controlled by changing pressing dies. The pressed wafer fabrication technique permits a higher oxidizer solids loading than is presently possible with a conventional extruded composite propellant. Production involves fewer process steps than a conventional colloidal gun propellant.
Document Details
- Document Type
- Technical Report
- Publication Date
- Aug 01, 1973
- Accession Number
- AD0771651
Entities
People
- Frank H. Bell