Method of Measurement of Electrical Contact Resistances on a Semiconductor-Solder Boundary in Thermoelectric Batteries,

Abstract

Contact resistances were determined from pressed plates whose resistance is compared with a bulk sample made with the same material and of identical dimensions. The method was applied to Bi-Sb, and Bi-Ti-Sn-Ag solders at 270-380K. The method is faster and more accurate than the probe method.

Document Details

Document Type
Technical Report
Publication Date
Dec 05, 1973
Accession Number
AD0771782

Entities

People

  • G. I. Ostrovskii

Organizations

  • United States Army Foreign Science and Technology Center

Tags

DTIC Thesaurus Topics

  • Boundaries
  • Carbides
  • Chemical Compounds
  • Compound Semiconductors
  • Electronics
  • Inorganic Carbon Compounds
  • Inorganic Chemicals
  • Materials
  • Measurement
  • Resistance
  • Semiconductors
  • Solid State Electronics

Fields of Study

  • Materials science

Readers

  • Solar Photovoltaics and Thermoelectric Devices.
  • Thermal Physics or Thermal Science.

Technology Areas

  • Microelectronics