Aluminum Oxide Passivation of Electron-Beam Semiconductor Silicon Diodes.

Abstract

DC and rf measurements have shown that beam-evaporated aluminum oxide constitutes a highly promising material for passivation of electron-beam-semiconductor targets. Aluminum-oxide-passivated targets are characterized by reverse breakdown voltages that range from 80% to essentially the full breakdown value and reverse leakage currents that are less than one microampere. A life of 2600 hours was demonstrated on an aluminum-oxide-passivated target at a current gain of 2200, a beam voltage of 12 kilovolts, power and current densities of 41.5 watts and 0.82 amperes per sq. mm, respectively, on a 0.012-inch active diameter. (Author)

Document Details

Document Type
Technical Report
Publication Date
Nov 01, 1973
Accession Number
AD0772101

Entities

People

  • H. C. Huang
  • R. W. Paglione
  • W. W. Siekanowicz

Organizations

  • RCA Corporation

Tags

Communities of Interest

  • Advanced Electronics

DTIC Thesaurus Topics

  • Aluminum
  • Aluminum Oxides
  • Chemical Compounds
  • Compound Semiconductors
  • Current Density
  • Diameters
  • Electron Beams
  • Electronics
  • Electrons
  • Films
  • Materials
  • Measurement
  • Oxides
  • Semiconductors
  • Solid State Electronics

Fields of Study

  • Physics

Readers

  • Electronics Engineering
  • Thin Film Deposition Science.

Technology Areas

  • Directed Energy
  • Directed Energy - Pulsed-Laser Deposition
  • Microelectronics