Aluminum-Oxide Passivation of Electron-Beam-Semiconductor Silicon and Gallium-Arsenide Diodes.

Abstract

Beam-evaporated aluminum oxide constitutes a highly promising material for passivation of electron-beam-semiconductor targets. Aluminum-oxide-passivated targets are characterized by reverse breakdown voltages that range from 80% to essentially the full breakdown value and reverse leakage currents that are less than one microampere. A life of 2600 hours was demonstrated on an aluminum-oxide-passivated silicon pn-junction at a current gain of 2200, a beam voltage of 12 kV, and power and current densities of 42 W and 0.82 A/sq. mm, respectively. A life of 770 hours has been accumulated on a gallium-arsenide Schottky-barrier diode at a current gain of 2000, a beam voltage of 12.8 kV, power and current densities of 20 W and 0.48 A/sq. mm, respectively. The active diameter of each target was 0.012 inch. (Author)

Document Details

Document Type
Technical Report
Publication Date
Feb 01, 1974
Accession Number
AD0775549

Entities

People

  • Dorothy Hoffman
  • Ho. C. Huang
  • Stewart Jolly
  • Wieslaw W. Siekanowicz
  • Yuen C. Chiang

Organizations

  • RCA Corporation

Tags

Communities of Interest

  • Advanced Electronics

DTIC Thesaurus Topics

  • Aluminum
  • Aluminum Oxides
  • Current Density
  • Diodes
  • Electron Beams
  • Electrons
  • Extrinsic Semiconductors
  • Gallium
  • Gallium Arsenides
  • Materials
  • Oxides
  • P-N Junctions
  • Schottky Diodes
  • Semiconductors

Fields of Study

  • Physics

Readers

  • Electrical Engineering
  • Semiconductor Device Technology
  • Space/Atmospheric Physics.

Technology Areas

  • Directed Energy
  • Directed Energy - Pulsed-Laser Deposition
  • Microelectronics