Damage Profiles in Silicon and Their Impact on Device Reliability

Abstract

It is the purpose of this report to substantiate the previously reported findings on saw damage in silicon wafer surfaces and their dependency on the slicing technique. The measurements reported here concentrate on 'measurements of damage depth' in as-sliced silicon wafers, on saw damage measurements in wafers , on saw damage measurements in wafers sliced horizontally (H-wafers) compared to wafers sliced vertically (V-Wafers), and, finally, on the measurement of fracture strength of silicon crystals and on the seed to tail variation of fracture strength in such crystals.

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Document Details

Document Type
Technical Report
Publication Date
Jan 01, 1974
Accession Number
AD0775843

Entities

People

  • Guenter H. Schwuttke

Organizations

  • International Business Machines Corporation (Armonk, NY)

Tags

DTIC Thesaurus Topics

  • Chemistry
  • Commerce
  • Contracts
  • Electron Microscopy
  • Electrons
  • Identification Systems
  • Materials
  • Microscopy
  • New York
  • Reliability
  • Security
  • Semiconductor Devices
  • Semiconductor Manufacturing
  • Semiconductors
  • Single Crystals
  • Transmission Electron Microscopy
  • X Rays

Fields of Study

  • Engineering

Readers

  • Atmospheric Science / Meteorology, specifically Wind Wave Turbulence.
  • Nanofabrication and Microfabrication.
  • Structural Health Monitoring of Composite Structures.