Reliability Study of Polyimide/Glass Multilayer Boards.
Abstract
A program was undertaken to thoroughly characterize polyimide resin thin laminate prepregs and completed multilayer boards while subjecting them to comprehensive electrical, mechanical, and environmental tests far exceeding the capabilities of other systems. The polyimide resin systems performed reliably during the tests with no evidence of degradation. It can be concluded from this program that polyimide resin, fiberglass-reinforced board materials are available that can produce multilayer printed wiring boards capable of continuous operation at over 150C and thermal cycling up to 200C without plated-through failure or degradation of electrical characteristics. These materials require no modification to existing laminating equipment or facilities. (Modified author abstract)
Document Details
- Document Type
- Technical Report
- Publication Date
- Jan 01, 1974
- Accession Number
- AD0777194
Entities
People
- Walter S. Rigling
Organizations
- Martin Marietta