Infrared Testing of Multi-Layer Boards.
Abstract
Calculations show that quickly heating the pad surface of a plated through hole in a multi-layer printed circuit board, and plotting the time/temperature curve as the heat flows into the hole structure, will indicate the quality of the plated through hole. Limitations exist as to the degree of disconnect and the number of layers that can be tested. Experiment suggests the validity of the calculations, but shows up problems in the practical usage of the system, in particular the selection and production of effective emissivity standardization coatings. (Author)
Document Details
- Document Type
- Technical Report
- Publication Date
- Apr 01, 1974
- Accession Number
- AD0780550
Entities
People
- Ralph W. Woodgate