Millimeter Wave Avalanche Transit Time Diode Amplifier.

Abstract

Preliminary flip-chip diodes were fabricated, and several wafers of GaAs epitaxial material were chosen for further diode development work. In addition to the diode effort, initial plans were made on the design of the avalanche diode amplifier. The approach chosen was a 3 stage ADA which assumed that the required circulator design and fabrication would be done in house in order to meet the overall amplifier requirements. During the second quarter, all of the effort was concentrated on the evaluation of GaAs epi material for its IMPATT diode potential. 50% of the initial 28 crystal wafers were found to be suitable for millimeter wave avalanche transit time diode fabrication. In order to reduce the parasitics and to increase the power handling capability of the diode the major portion of the effort concentrated on the fabrication of plated heat sink (PHS) type millimeter wave IMPATT diodes. Nine wafers were recommended for PHS diode fabrication. (Modified author abstract)

Document Details

Document Type
Technical Report
Publication Date
May 01, 1974
Accession Number
AD0780702

Entities

People

  • Leslie H. Sims
  • Wen C. Chen

Organizations

  • RTX

Tags

Communities of Interest

  • Advanced Electronics

DTIC Thesaurus Topics

  • Absorbers (Materials)
  • Amplifiers
  • Avalanche Diodes
  • Diodes
  • Fabrication
  • Flip Chips
  • Heat Sinks
  • Impatt Diodes
  • Materials
  • Millimeter Waves

Readers

  • Electronics Engineering
  • Integrated Circuit Design and Technology.

Technology Areas

  • 5G