Thermoelectric Materials at 300k.
Abstract
The purpose of this study was to investigate the present possibilities for thermoelectric materials improvement and to determine a realistic least upper bound on the thermoelectric figure of merit (Z). This study is restricted to materials used for Peltier cooling, and particularly those applicable to air conditioning applications. In a broader sense, fabrication and assembly technology were considered concurrently although the emphasis was placed upon the materials aspect.
Document Details
- Document Type
- Technical Report
- Publication Date
- Jun 01, 1974
- Accession Number
- AD0781545
Entities
People
- C. F. Sepsy
- D. E. Shapiro
- J. W. Harpster
- R. Devore
- W. W. Anderson
Organizations
- Ohio State University