Fungus and Corrosion Induced Failure Mechanisms.

Abstract

This study was undertaken to define some of the mechanisms by which electronic equipment fails in field service and storage. Circuits were assembled under different controlled conditions and then exposed to humidity, salt fog and fungus growth. The properties studied included moisture absorption, moisture transmission, insulation resistance, leakage currents and electrical parameters characteristic of specific devices. Several conformal coatings (acrylic, epoxy, polyurethane and silicone) WERE COMPARED FOR THEIR ABILITY TO MAINTAIN RELIABLE OPERATION. (Author, modified-PL)

Document Details

Document Type
Technical Report
Publication Date
Apr 29, 1974
Accession Number
AD0783361

Entities

People

  • E. R. Brands
  • F. Y. Hayashi

Tags

DTIC Thesaurus Topics

  • Absorption
  • Corrosion
  • Electronic Equipment
  • Failure Mode And Effect Analysis
  • Humidity
  • Insulation
  • Material Degradation Processes
  • Materials
  • Moisture
  • Polyurethanes
  • Resistance

Readers

  • Microwave Engineering.
  • Polymer Science and Engineering.
  • Systems Analysis and Design

Technology Areas

  • Microelectronics