PHYSICAL VAPOR DEPOSITION,

Abstract

The purpose of this report is to describe the equipment and state-of-the-art of processes used in physical vapor deposition (PVD), the properties and applications of articles coated by PVD, and methods of testing coated products. PVD, which includes the well known 'vacuum metallizing,' is the most frequently used means for depositing coatings from the vapor phase. A major characteristic of PVD is that the coating material is identical with the source material. The processes of PVD may be grouped into three general classes, according to the manner in which the source material is vaporized: (1) those that utilize sublimation or evaporation (this group includes 'vacuum metallizing'), (2) sputtering, and (3) ion plating.

Document Details

Document Type
Technical Report
Publication Date
Mar 31, 1966
Accession Number
AD0803390

Entities

People

  • A. G. Imgram
  • Christine M. Jackson
  • J. F. Shea
  • J. G. Kura
  • V. D. Barth

Organizations

  • Battelle Memorial Institute

Tags

DTIC Thesaurus Topics

  • Coatings
  • Deposition (Materials Processing)
  • Evaporation
  • Fluids
  • Materials
  • Materials Processing
  • Metallizing
  • Phase
  • Physical Vapor Deposition
  • Sputtering
  • Sublimation
  • Vapor Deposition
  • Vapor Phases
  • Vapors

Fields of Study

  • Materials science

Readers

  • Nanofabrication and Microfabrication.
  • Systems Analysis and Design
  • Thermal Physics or Thermal Science.