EVALUATION OF FLIP/CHIP INTEGRATED CIRCUIT INTERCONNECTIONS.

Abstract

In the final quarter of this study, work concentrated on thermal and ultrasonic methods of solder bonding and on methods and problems associated with packaging a Flip/Chip module. Finally, an evaluation was made of all the information gathered and a best approach selected. (Author)

Document Details

Document Type
Technical Report
Publication Date
Jan 25, 1967
Accession Number
AD0806935

Entities

Organizations

  • Honeywell International, Inc.

Tags

DTIC Thesaurus Topics

  • Circuit Interconnections
  • Circuits
  • Integrated Circuits
  • Packaging
  • Test And Evaluation

Fields of Study

  • Engineering

Readers

  • Software Engineering
  • Thermal Physics or Thermal Science.