ELASTOMERIC AND MECHANICAL PROPERTIES OF POLY-M-CARBORANYLENE SILOXANES, III.

Abstract

Stress relaxation properties of SiB-2 and poly(dimethyl siloxane) were compared in air and pure nitrogen. The effect of a protective filler system was also investigated. Within the framework of the present experiments, SiB-2 exhibits greater stability than poly(dimethyl siloxane) at elevated temperatures, retaining useful properties after 24 hours in air at 260C in the absence of protective filler. As expected, use of a nitrogen atmosphere, protective filler, or both raise the maximum useful temperature significantly. The crystalline structure of SiB-2 was investigated by x-ray techniques and force-temperature experiments. The thermodynamic melting point was found to be 66C, and qualitative information was obtained on the crystallite size distribution. The physical properties of SiB-1 were investigated by modulus-temperature methods. This polymer was highly crystalline. The second-order transition occurred at 25C, and melting at 240C. Above this temperature, SiB-1 exhibited a characteristic rubbery plateau, which terminated at 355C when oxidative crosslinking became significant. SiB-1 appears to be significantly more stable than SiB-2 at elevated temperatures. It seems likely that a copolymer may exhibit properties superior to either, and it is recommended that several compositions be prepared and investigated. (Author)

Document Details

Document Type
Technical Report
Publication Date
Jan 01, 1967
Accession Number
AD0807340

Entities

People

  • Arthur V. Tobolsky
  • Emmanuel J. Zaganiaris
  • Leslie H. Sperling

Organizations

  • Princeton University

Tags

DTIC Thesaurus Topics

  • Atmospheres
  • Copolymers
  • Crystallites
  • Mechanical Properties
  • Melting
  • Melting Point
  • Nitrogen
  • Phase Transformations
  • Physical Properties
  • Polymers
  • Quantum Properties
  • Transitions
  • X Rays

Fields of Study

  • Materials science

Readers

  • Electrochemical Surface Science
  • Nanocomposite Materials Science
  • Thermal Physics or Thermal Science.

Technology Areas

  • Microelectronics