MANUFACTURING IN-PROCESS CONTROL AND MEASUREMENT TECHNIQUES FOR INTEGRAL ELECTRONICS (CONNECTIONS AND LIFETIME).

Abstract

A program directed toward the development of contactless, non-destructive techniques for the measurement and ultimately for the control of: (1) carrier lifetime in semiconductors (silicon); and (2) lead/header bonding integrity (silicon-gold-sapphire). Two concepts for contactless carrier lifetime measurements were investigated: (1) laser-induced modulation of infrared transmission through silicon; and (2) laser-induced modulation of photo-electric emission from silicon. The concept studied under the lead and header bonding integrity portion of this effort was the correlation of mechanical bond strength with polarized infrared displays of the birefringent stress pattern induced in silicon as a result of the bonding process. Equipment developed for the study and evaluation of these contactless measurement techniques is described. (Author)

Document Details

Document Type
Technical Report
Publication Date
Feb 01, 1967
Accession Number
AD0809945

Entities

People

  • Arthur A. Klebba
  • Robert A. Dicurcio

Tags

Communities of Interest

  • Advanced Electronics

DTIC Thesaurus Topics

  • Chemical Compounds
  • Compound Semiconductors
  • Electronic Equipment
  • Electronics
  • Emission
  • Inorganic Chemicals
  • Integrals
  • Manufacturing
  • Measurement
  • Modulation
  • Modules (Electronics)
  • Sapphire
  • Semiconductor Devices
  • Semiconductors
  • Solid State Electronics
  • Test And Evaluation

Fields of Study

  • Materials science

Readers

  • Materials Science and Engineering.
  • Software Engineering

Technology Areas

  • Directed Energy
  • Microelectronics