INTERCONNECTION OF FUNCTIONAL ELECTRONIC BLOCKS.
Abstract
Two distinct structures for interconnecting functional electronic blocks have been developed. These structures are mutually compatible such that interconnection between the two structures is possible. An unbalanced production line has been set up for assembly of the interconnection matrices. One structure consists of ceramic boards with feedthrough holes and metallized interconnection patterns which are 'vacuum cast' to form a multilayer interconnection matrix. Encapsulated functional electronic blocks are then electron beam welded to the multilayer board. The second structure is a vertical stack of ceramic wafers which have unencapsulated functional electronic blocks bonded to them. Interconnection is accomplished by copper riser wires that are electron beam welded around the periphery of the stack. As a demonstration of the capabilities of both structures, eight functioning digital timer circuits were fabricated and delivered. Each timer circuit is composed of a multilayer structure on which are interconnected two vertical stack structures and eight encapsulated Functional Electronic Blocks (FEB's). A 20 meter band receiver using analog FEB's was also fabricated to demonstrate the operation of the multilayer interconnection matrix at radio frequencies. (Author)
Document Details
- Document Type
- Technical Report
- Publication Date
- Mar 01, 1967
- Accession Number
- AD0812324
Entities
People
- Arthur R. Riben
- Domenick J. Garibotti
- Kalmar O. Olson
- Paul O'Brien
- Peter B. Brunone