THERMAL SHOCK EVALUATION OF THE MORE COMMON TYPES OF PRINTED CIRCUIT BOARD INTERFACIAL CONNECTIONS.
Abstract
This report describes a study of the merits of various printed circuit board interfacial connections. These interfacial connections were subjected to extensive thermal shock cycling in order to determine their effectiveness. The results of this thermal shock cycling program will be utilized along with the results of other testing conducted by the Institute of Printed Circuits (IPC) in the preparation of specifications and standards for Government and Industry. The other testing programs which were conducted by the associate IPC organizations included insulation degradation and flexural fatigue. (Author)
Document Details
- Document Type
- Technical Report
- Publication Date
- Jul 01, 1965
- Accession Number
- AD0815608
Entities
People
- Dominic R. Delli Sante
- Erle N. Niemi
Organizations
- Picatinny Arsenal