FAILURE MECHANISMS IN SEMICONDUCTOR DIODES.

Abstract

This is the fourth Semi-Annual Report on a three-year contract for the investigation of long term failure mechanisms in semiconductor diodes. The report covers the last half of the second year's effort and is organized into nine sections and two appendices. The first five sections are related to the effort of structuring the degradation model, the sixth section covers the summary of the step-stress results, and the remaining sections contain a summation of the data obtained, as well as an analysis of the significance of the data. The first appendix is used to group all of the data for the high temperature and zero bias stresses, and the second appendix provides examples of some of the failure analyses which have been conducted. (Author)

Document Details

Document Type
Technical Report
Publication Date
Jun 01, 1967
Accession Number
AD0818103

Entities

People

  • Albert Fox
  • Alfred Poe
  • Byron L. Bair
  • Erwin A. Herr
  • John F. Schenck

Organizations

  • General Electric

Tags

Communities of Interest

  • Advanced Electronics

DTIC Thesaurus Topics

  • Compound Semiconductors
  • Contracts
  • Degradation
  • Diodes
  • Electronics
  • Failure Analysis
  • Failure Mode And Effect Analysis
  • High Temperature
  • Semiconductor Diodes
  • Semiconductors
  • Solid State Electronics

Fields of Study

  • Engineering

Readers

  • Business Analytics
  • Semiconductor Device Technology
  • Structural Health Monitoring of Composite Structures.

Technology Areas

  • Microelectronics