RELIABILITY OF MICROELECTRONIC CIRCUIT CONNECTIONS.
Abstract
This report describes the test program used for establishing failure rates of lap soldered and parallel gap welded microelectronic circuit connections in environmental tests simulating condition of usage. In order to determine failure rates based on pre-program estimates (0.00001%/1000 hours at 90 percent confidence level), it would require accumulating a billion joint hours without failure; a program considered prohibitive from a cost standpoint. An alternate method was adopted which involved subjecting approximately fifty thousand normal, marginal and submarginal connections to both usage conditions and accelerated conditions. The report includes the technical approach and test procedures used to produce results which, when coupled with metallurgical analyses of failure mechanisms, were reduced statistically to failure rates. A quantity of failures with acceptable modes and mechanisms and sufficient to establish a 90 percent confidence level, a failure rate of 0.000012%/1000 hours, was induced in soldered connections. The limited quantity of failures experienced in welded connections led to the conclusion that their failure rate was equal to, or less than, 0.000012%/1000 hours. (Author)
Document Details
- Document Type
- Technical Report
- Publication Date
- Sep 01, 1967
- Accession Number
- AD0820993
Entities
People
- A. G. Gross
- J. L. Behhedahl
- M. H. Bester
- R. D. Bryant