THIN FILM THERMISTOR TEMPERATURE SENSOR.

Abstract

Thin film radiosonde thermistors have been developed which can replace the current ML-419/AMT-4 radiosonde element. These units required the special development of a new thermistor material as well as a new method of application. The new material has a temperature coefficient of 3.07%, a beta of 2732 K and a 0 to 50 C ratio of 4.7. This material can be further modified in order to shift these parameters. Low energy sputtering techniques were developed which allow this material to be deposited on various substrates intact. Substrates included aluminum oxide, beryllium oxide and aluminum foil. The films are stable and can take temperatures to 125 C if necessary, are rugged and have feasible dissipation and time constants. (Author)

Document Details

Document Type
Technical Report
Publication Date
Sep 01, 1967
Accession Number
AD0823193

Entities

People

  • John G. Froemel
  • Meyer Sapoff

Tags

Communities of Interest

  • Advanced Electronics

DTIC Thesaurus Topics

  • Aluminum
  • Aluminum Foil
  • Aluminum Oxides
  • Coefficients
  • Elements
  • Films
  • Materials
  • Oxides
  • Radiosondes
  • Substrates
  • Temperature Coefficients
  • Thermistors
  • Thin Films

Readers

  • Electronics Engineering
  • Thermal Physics or Thermal Science.
  • Thin Film Deposition Science.