INVESTIGATION OF HEAT REMOVAL FROM BOTH SIDES OF A TRANSISTOR CHIP EMPLOYING BUMP TECHNOLOGY.
Abstract
The following items were completed. (1) The design of four separate device structures; (2) The photolithographic masks were laid out and fabricated; (3) Nine lots of six wafers each were committed to processing with completed bumped dice from the initial lots available for mounting to headers; (4) Header design completed and delivery of 200 packages has been received; (5) A total of four dice have been successfully mounted on headers and are in evaluation. Problems have been encountered in device degradation, metallization, and in mounting the dice to headers. However, these problems are better understood now, and proper steps were taken to alleviate them. (Author)
Document Details
- Document Type
- Technical Report
- Publication Date
- Dec 01, 1967
- Accession Number
- AD0824673
Entities
People
- H. F. Rueffer
- R. J. Belardi
Organizations
- Hughes Aircraft Company