THERMAL ASPECTS OF INTEGRATED CIRCUITRY.

Abstract

Contents: Design Considerations for a High Dissipation-Low Thermal Resistance Integrated Circuit Package; Integrated Circuit Device to Sink Thermal Analysis; and Miniaturized Electronic Thermal Alarm.

Document Details

Document Type
Technical Report
Publication Date
Dec 15, 1967
Accession Number
AD0829336

Entities

People

  • J. R. Welling

Organizations

  • Motorola Mobility

Tags

DTIC Thesaurus Topics

  • Circuits
  • Contracts
  • Dissipation
  • Integrated Circuits
  • Resistance
  • Thermal Analysis
  • Thermal Resistance

Readers

  • Combustion and Flow Dynamics.
  • Integrated Circuit Design and Technology.

Technology Areas

  • Microelectronics