INVESTIGATION OF RELIABILITY TESTING AND PREDICTION TECHNIQUES FOR INTEGRATED CIRCUITS EXTENSION B.

Abstract

The work was conducted to verify a reliability screening procedure for the SN5420 Integrated Circuit. Results of the tests and analyses conducted during the evaluation of this procedure indicate that changes to the procedure were necessary to screen for failure modes encountered for the first time in the contract during Extension B tests. The recommended new screening procedure contains all the previous stress and inspection techniques but in a modified sequence. The most significant change, incorporation of 300C storage prior to lot capsulation, is recommended to improve the effectiveness of the 100% die inspection screen. (Author)

Document Details

Document Type
Technical Report
Publication Date
Feb 01, 1968
Accession Number
AD0829847

Entities

People

  • Irene V. Symons
  • Walter L. Gill

Organizations

  • Texas Instruments

Tags

DTIC Thesaurus Topics

  • Circuits
  • Contracts
  • Failure Mode And Effect Analysis
  • Inspection
  • Integrated Circuits
  • Performance (Engineering)
  • Reliability
  • Sequences
  • Test And Evaluation

Fields of Study

  • Engineering

Readers

  • Aerospace Test and Evaluation
  • Integrated Circuit Design and Technology.
  • Systems Analysis and Design