INVESTIGATIONS TO UNDERSTAND THE DEFORMATION AND STRENGTHENING MECHANISMS OF THE SOLID SOLUTION PHASES OF TITANIUM,

Abstract

Mechanical properties data are reported for alpha-titanium of four impurity contents and various grain sizes, tested in the temperature range 4.2K to 800K. Dislocation substructures produced by deformation of commercial purity and high purity alpha-titanium at room temperature were examined by transmission electron microscopy and representative examples are presented and discussed. Work hardening behavior is connected with long-range interactions and is modified by both purity and grain size as well as temperature. The effect of impurity content appears to be related to the degree to which dislocations are restricted to their slip planes. Grain size also influences the yield and flow stresses, the relations observed being approximately of the Hall-Tetch type. The effects of grain size are shown to be athermal in nature and are accounted for in terms of work hardening model. Thermal activation analysis is used to show that the behavior reported is in agreement with the concept that the rate controlling process for low temperature deformation is thermally activated dislocation glide on first order prism planes over barriers associated with individual interstitial impurity atoms. The analysis shows that the nature of barriers is the same in all four materials and that the rate controlling process is unaffected by either grain size or plastic strain. (Author)

Document Details

Document Type
Technical Report
Publication Date
Feb 01, 1968
Accession Number
AD0834868

Entities

People

  • B. R. Banerjee
  • F. W. Cooke
  • H. Conrad
  • R. L. Jones

Tags

Communities of Interest

  • Air Platforms

DTIC Thesaurus Topics

  • Dislocations
  • Electron Microscopy
  • Grain Size
  • Hardening
  • Impurities
  • Low Temperature
  • Mechanical Properties
  • Microscopy
  • Solid Solutions
  • Titanium
  • Transmission Electron Microscopy

Fields of Study

  • Materials science

Readers

  • Materials Science and Engineering.

Technology Areas

  • Microelectronics