THIN FILM STRUCTURAL REINFORCEMENTS FOR HIGH PERFORMANCE COMPOSITES.

Abstract

The work is a continuation of the development of high modulus, high strength, low density composites, which have mechanical properties which are isotropic in the plane of the composite. Composites were made of multiple sheets of vacuum deposited boron or boron carbide applied to substrates such as aluminum foil or 0.5 mil polyimide (Kapton). Methods for increasing the degree of adhesion of boron and boron carbide to the substrate materials were developed. Experimental work indicates that the evaporation and deposition of boron and boron carbide was considerably less difficult than the evaporation and deposition of silicon carbide. Increased volume fractions of reinforcement in composites were obtained by use of temporary substrates. Samples of boron carbide, boron and silicon carbide on polyimide and boron carbide and boron on aluminum were supplied to AFML. (Author)

Document Details

Document Type
Technical Report
Publication Date
Apr 01, 1968
Accession Number
AD0837242

Entities

People

  • Earl E. Chadsey
  • Frank Feakes

Tags

Communities of Interest

  • Air Platforms

DTIC Thesaurus Topics

  • Aluminum
  • Aluminum Foil
  • Boron Carbides
  • Carbides
  • Ceramic Materials
  • Composite Materials
  • Compound Semiconductors
  • Evaporation
  • Films
  • Low Density
  • Materials
  • Mechanical Properties
  • Silicon
  • Silicon Carbide
  • Substrates
  • Thin Films

Fields of Study

  • Materials science

Readers

  • Reinforced Composite Materials
  • Thin Film Deposition Science.