INVESTIGATION OF THE FUNCTIONAL PERFORMANCE VARIATIONS OF AN INTEGRATED CIRCUIT CHIP AS A FUNCTION OF TEMPERATURE.

Abstract

The paper discusses the laboratory methods and analysis techniques used in investigating the temperature effects upon the functional performance of a micro-electronic circuit. The performance parameters investigated were output voltage, bandwidth, and phase shift between the input and output voltages. Nine sample devices were subjected to varied electrical and environmental input conditions in controlled laboratory experiments to collect data. Curve fitting techniques were used to determine the underlying mathematical relationships between the input conditions and the performance parameters. The coefficient of correlation for each equation was calculated as a measure of how well the equation described the process. The expected errors and their distributions were computed for each of the equations. Computer simulation techniques were used to generate the joint frequency distribution of the performance parameters. The temperature effects upon performance were investigated through the performance equations and appropriate derivatives of these equations. (Author)

Document Details

Document Type
Technical Report
Publication Date
Nov 01, 1966
Accession Number
AD0838811

Entities

People

  • Robert Powell Armstrong

Organizations

  • Air Force Institute of Technology

Tags

Communities of Interest

  • Materials and Manufacturing Processes

DTIC Thesaurus Topics

  • Circuits
  • Computer Simulations
  • Curve Fitting
  • Electronic Circuits
  • Equations
  • Frequency
  • Integrated Circuits
  • Phase Shift
  • Simulations

Readers

  • Aerospace Test and Evaluation
  • Control Systems Engineering.
  • Integrated Circuit Design and Technology.

Technology Areas

  • Microelectronics
  • Microelectronics - Microelectromechanical Systems