MEMORY SYSTEM FOR MICROCIRCUITS.

Abstract

A program to design and develop manufacturing processes for a compact, low power, modular memory is described. The memory uses electroplated magnetic film storage elements, vacuum evaporated wiring and insulation, integrated circuits ultrasonically face-down bonded to evaporated wiring, and welded copper-Mylar tape interconnections. Design, fabrication, and test of the memory is reported. Manufacturing processes and equipment are described for magnetic film plating, vacuum evaporation, face-down bonding, and copper-Mylar tape welding. Development of a set of integrated selection and recirculation circuits is reported. (Author)

Document Details

Document Type
Technical Report
Publication Date
Aug 01, 1968
Accession Number
AD0840576

Entities

People

  • Marvin I. Weilerstein

Organizations

  • Sperry Corporation

Tags

Communities of Interest

  • Advanced Electronics
  • Materials and Manufacturing Processes

DTIC Thesaurus Topics

  • Circuit Testers
  • Circuits
  • Electronic Equipment
  • Evaporation
  • Fabrication
  • Films
  • Insulation
  • Integrated Circuits
  • Magnetic Films
  • Manufacturing
  • Microcircuits
  • Modules (Electronics)
  • Test Equipment

Fields of Study

  • Physics

Readers

  • Integrated Circuit Design and Technology.
  • Software Engineering
  • Superconducting Magnet Technology

Technology Areas

  • Microelectronics
  • Microelectronics - Graphene