Reliability Studies for Advanced Integrated Circuits Engineering Change 'A'.

Abstract

The goal of this phase (II) of the program was to measure the effectiveness of a sequence of nondestructive screening tests in detecting and weeding out unreliability silicon monolithic analog microcircuits from production lots to eliminate the failure modes that had been determined during Phase I to exist in such dielectric (SIO2) isolated devices. The contract specified a sequence of nine tests (visual and environmental) to be performed. The stress conditions were to be dictated by the results of the first phase. The required tests were visual examinations, high temperature cycling, centrifuge and package leak testing. Of the 220 devices thus tested, the surviving microcircuits were then placed on 2000-hour operating life test at 125C ambient. The results of the tests on this group were then compared with those on a control group of 100 devices which had been subjected to no screening tests except visual inspections, leak testing, and electrical testing, but which were placed on the same operating life test. (Author)

Document Details

Document Type
Technical Report
Publication Date
Oct 01, 1968
Accession Number
AD0843321

Entities

People

  • Augustine R. Aufderheide
  • Joseph A. Hastings

Tags

Communities of Interest

  • Advanced Electronics

DTIC Thesaurus Topics

  • Circuits
  • Electrical Engineering
  • Engineering
  • Failure Mode And Effect Analysis
  • High Temperature
  • Inspection
  • Integrated Circuits
  • Life Tests
  • Microcircuits
  • Reliability
  • Sequences
  • Visual Inspection

Readers

  • Brain and Cognitive Science; Experimental Psychology; Cognitive Neuroscience
  • Integrated Circuit Design and Technology.
  • Structural Health Monitoring of Composite Structures.

Technology Areas

  • Microelectronics
  • Microelectronics - Microelectromechanical Systems