Ultrasonic Face Bond Reliability Study

Abstract

The report discusses a program concerned with the effect of ultrasonic bonding energy on the oxide coating of integrated circuit chips; to experimentally determine the optimum face-bonded assembly design; and to fabricate and test a number of the 'practical best' assemblies.

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Document Details

Document Type
Technical Report
Publication Date
Oct 01, 1968
Accession Number
AD0844325

Entities

People

  • A. G. Gross Jr.
  • A. M. Kinan
  • B. T. Hogan
  • N. F. Scudder
  • W. A. Schmoyer

Tags

DTIC Thesaurus Topics

  • Assembly
  • Ceramic Materials
  • Chemistry
  • Circuits
  • Electrical Circuits
  • Electrical Measurement
  • Electronic Equipment
  • Energy
  • Fabrication
  • Failure Mode And Effect Analysis
  • Integrated Circuits
  • Materials
  • Measurement
  • Metals
  • Test And Evaluation
  • Test Equipment
  • Transducers

Readers

  • Electromagnetic Wave Scattering and Antenna Radiation Engineering
  • Integrated Circuit Design and Technology.
  • Surface Coatings Technology.