UHF Film Integrated Circuits.
Abstract
The purpose of this project is to investigate lumped-element vs. microstrip circuitry for use at microwave frequencies (up to X-band), with highpower active devices, and as transforming networks between radically different impedances. Requirements for high-quality integrated lumped elements and microstrip transmission lines are discussed. Besides the standard Cu and Au evaporation of conductors, at least one skin depth of W and Mo has been successfully sputtered and vapor-deposited on sapphire. Characteristics of several glasses have been studied, and techniques to obtain densified glasses with low dielectric losses have been improved. Various integrated systems involving metal-dielectric-metal sandwiches have been tried, and a gold-glass-copper-gold sandwich has been found to be a satisfactory compromise. The loss measurements of networks, utilizing the scattering-coefficient method (Deschamps), are described. A resonance measurement to study lumped elements at S- to X-band frequencies is analyzed; lumped-element inductors remain truly lumped up to at least 6 GHz. Performance of uncoupled microstrip lines in the form of filters, branch-line couplers, and phase shifters is described. Directional couplers have been designed and fabricated, and measurements on coupled lines have been made to determine the even- and odd-mode characteristics. Preliminary results on the operation of a microstrip quadrupler (1.77 to 7.08 GHz), at 1.6 watts with 28% efficiency are reported. (Author)
Document Details
- Document Type
- Technical Report
- Publication Date
- Nov 01, 1968
- Accession Number
- AD0844883
Entities
People
- Bernard Hershenov
- Louis S. Napoli
- Martin Caulton
- Paul Schnitzler
- Wieslaw W. Siekanowicz
Organizations
- Sarnoff Corporation