The KME-3 Technology -- An Economical Variant for the Preparation of Thin-Layer Hybrid Circuits,
Abstract
In order to make possible the application of hybrid thin-film switching circuits, the Hermsdorf Ceramic Works (East Germany) has developed a relatively simple and economical procedure, termed the KME-3 technique, for fabricating integrated switching circuits. The necessary manufacturing equipment, which is described briefly, was designed and built by the Manfred von Ardene Research Institute in Dresden. In this procedure, an NiCr resistive film is first deposited on a clean glass substrate by evaporation (glass substrates are used rather than ceramic ones because of their lower cost). Then, in a second evaporation process, interconnections are deposited. After being separated from the substrate, the interconnections are tin-plated, the leads are attached, and the active elements (i.e. transistors) are installed. Finally, the circuit is encapsulated and its switching function is measured. If they are required, discrete capacitors are deposited by evaporation. Generally, the electrodes are made from special Fe alloys. Circuit diagrams illustrating some practical circuit configurations are given. (Author)
Document Details
- Document Type
- Technical Report
- Publication Date
- Feb 21, 1968
- Accession Number
- AD0846675
Entities
People
- E. Schleicher
- J. Henneberger
- O. Thieme
- S. Schiller
- U. Heisig
Organizations
- National Air and Space Intelligence Center