Quality Defects in Integrated Circuits.

Abstract

The study was conducted in order to identify and classify processing defects observed in integrated circuits, and to determine the relative importance of these defects in terms of product reliability. Its primary concern has been with defects induced during wafer processing and subsequent operations, such as electrical die sort, scribing, and bonding. The study had, as a corollary objective, the development of effective screens to segregate circuits containing these defects, without impairing the quality of the resulting set of devices designated for ultimate usage in the end product. (Author)

Document Details

Document Type
Technical Report
Publication Date
Dec 01, 1968
Accession Number
AD0846723

Entities

People

  • Peter Gott
  • Richard Soltau

Tags

DTIC Thesaurus Topics

  • Circuits
  • Electrical Circuits
  • Electrical Equipment
  • Electronic Circuits
  • Electronic Equipment
  • Electronics
  • Integrated Circuits
  • Reliability

Readers

  • Integrated Circuit Design and Technology.
  • Systems Analysis and Design
  • Theoretical Analysis.