Integrated Circuit Engineering,
Abstract
The author surveys circuit microminiaturization of electronic equipment. As the most recent method he cites the use of solid-state circuits, i.e., thick film, thin film, 'MOS', and hybrid circuitry and lists progressive miniaturization from electronic tube to biological system. Semiconductor block engineering and transistorization, especially in relation to silicon and germanium, are discussed and insulated solid state circuits are emphasized including diffusion methods, epitaxially grown layers and the use of elements consisting of very thin oxide layers, or of wide intermediate air spaces (beam-lead engineering). (Author)
Document Details
- Document Type
- Technical Report
- Publication Date
- Jun 20, 1968
- Accession Number
- AD0848448
Entities
People
- D. Sager
Organizations
- National Air and Space Intelligence Center