Effects on Electronic Equipment Reliability of Temperature Cycling in Equipment.
Abstract
Analysis of flight test data on the temperature of electronic parts cooled by open loop cooling techniques has shown that there is temperature cycling of the parts during flight. An experimental investigation of the effects of two conditions of temperature cycling on equipment reliability was conducted. (Author)
Document Details
- Document Type
- Technical Report
- Publication Date
- Feb 28, 1969
- Accession Number
- AD0851884
Entities
People
- F. H. Kube
- W. F. Hilbert
Organizations
- Grumman