Missileborne Mass Memory. Volume II.
Abstract
Present plated wire memory planes tend to be rather long and thin in shape. There is also some wasted space when they are stacked. In order to improve the shape and density, an extensive investigation of various stack configurations was made. The results are detailed in Appendix I. An approach - a folded stack - was selected. In order to improve packaging density and reliability, a quad sense amplifier was developed for the plated wire memory. The amplifier is described and preliminary test results are indicated in Appendix II.
Document Details
- Document Type
- Technical Report
- Publication Date
- Apr 01, 1969
- Accession Number
- AD0853917
Entities
People
- Jack W. Meyer
- Thomas E. Anspach
- William A. England
Organizations
- Honeywell International, Inc.