UHF Film Integrated Circuits.
Abstract
The purpose of this project is to investigate lumped-element vs. microstrip circuitry for use (1) at microwave frequencies (up to X-band), (2) with high-power active devices, and (3) as transforming networks between radically different impedances. (1) Materials and Technology - Thin-film SiO2 has been densified at moderate temperatures using a water-vapor atmosphere which improves the quality of the dielectric significantly. However, the integrated metal-dielectric-metal sandwich has been degraded by the processing, and the resultant circuit loss is only moderately lower. (2) Measurement Technique - The resonance technique has been used to measure the reactance of lumped elements through X-band. (3) Lumped-Element Hybrids - The integrated versions of directional couplers and filters have been designed and some circuits have been fabricated. (4) Distributed Circuits - A study of chrome resistors in microstrip lines has been made. Further results have been obtained on the frequency-dependent behavior of microstrip lines. (Author)
Document Details
- Document Type
- Technical Report
- Publication Date
- Jun 01, 1969
- Accession Number
- AD0854257
Entities
People
- Bernard Hershenov
- Louis S. Napoli
- Martin Caulton
- Stanley P. Knight
Organizations
- Sarnoff Corporation