Thermal Parameters and Analytical-Experimental Procedures for Integrated Circuit Devices and Systems.
Abstract
Results of studies of thermal considerations in integral circuit (IC) devices and systems is presented. Covered are IC thermal parameters, thermal instrumentation and temperature measuring techniques, computer implemented thermal analyses, magnitudes of thermal gradients and thermal resistances, design considerations for a high dissipation-low thermal resistance IC package, IC package to sink thermal analyses, and an IC thermal alarm system. The information presented should be of use to both the user and the manufacturer of integrated circuits. (Author)
Document Details
- Document Type
- Technical Report
- Publication Date
- May 05, 1969
- Accession Number
- AD0855278
Entities
People
- B. T. Plizak
Organizations
- Naval Air Warfare Center Warminster