Evaluation of Selected Three Layer Thin Films for Compatibility with Hybrid Microelectronic Fabrication Techniques.

Abstract

The report evaluates several types of three layer thin films for compatibility with standard microelectronic interconnection techniques. Specifically, it was determined if any of the materials used as intermediate layers were capable of functioning as a diffusion barrier at the elevated temperatures required for eutetic die mounting and thermocompression wire bonding. (Author)

Document Details

Document Type
Technical Report
Publication Date
Jun 09, 1969
Accession Number
AD0858178

Entities

People

  • Thomas E. Higbie

Tags

Communities of Interest

  • Advanced Electronics

DTIC Thesaurus Topics

  • Diffusion
  • Fabrication
  • Films
  • Materials
  • Standards
  • Test And Evaluation
  • Thin Films

Readers

  • Parallel and Distributed Computing.
  • Software Engineering
  • Thin Film Deposition Science.

Technology Areas

  • Microelectronics
  • Microelectronics - Graphene