Procedural Guidelines for the Reliability Assessment of Large-Scale Integrated Circuits.

Abstract

A study and investigation was performed to develop procedural guidelines for predicting and assessing the reliability of electronic equipment and systems using large-scale integrated (LSI) circuit arrays. The program included an analytical study of available published information, supplemented by experimental studies of multilevel metallized structures and LSI arrays. An extensive bibliography, containing over 450 references, was compiled. The analytical studies performed included a determination and detailed consideration of the factors that affect the reliability of LSI arrays, including important reliability-related factors in the fabrication processes. Consideration was given to reliability screening, electrical acceptance testing of finished LSI arrays, and system considerations. (Author)

Document Details

Document Type
Technical Report
Publication Date
Aug 01, 1969
Accession Number
AD0858369

Entities

People

  • Earl S. Schlegel
  • George Schnable
  • Michael M. Schlacter
  • Ralph S. Keen
  • Richard A. Lathlaen

Tags

Communities of Interest

  • Materials and Manufacturing Processes

DTIC Thesaurus Topics

  • Circuits
  • Electronic Circuits
  • Electronic Equipment
  • Integrated Circuits
  • Large Scale Integrated Circuits
  • Large Scale Integration
  • Modules (Electronics)
  • Reliability
  • Semiconductor Devices
  • Semiconductor Manufacturing
  • Test Equipment

Fields of Study

  • Engineering

Readers

  • Integrated Circuit Design and Technology.
  • Systems Analysis and Design

Technology Areas

  • Microelectronics