Thin-Film Channel Multiplier Arrays.

Abstract

The purpose of this program is to investigate the feasibility of fabricating thin-wafer channel-multiplier arrays by a novel approach and to produce experimental operational models thereof suitable for evaluating the performance characteristics and potential capabilities of such devices. The approach involves using advanced thin-film technology to prepare a base film with a dense array of submicron-size holes, followed by deposition of dynode material on the base to form the individual channel walls. A conductive film on each channel wafer face will permit application of the requisite operational potential. The dense wafers are to be constructed entirely of refractory materials in a vacuum environment. (Author)

Document Details

Document Type
Technical Report
Publication Date
Jan 01, 1969
Accession Number
AD0862229

Entities

People

  • C. A. Spindt
  • D. R. Cone

Organizations

  • SRI International

Tags

DTIC Thesaurus Topics

  • Environment
  • Films
  • Materials
  • Refractory Materials
  • Thin Films

Readers

  • Computational Modeling and Simulation
  • Nanofabrication and Microfabrication.