High Temperature Resins for Structural Laminates and Adhesives.
Abstract
Imidazoquinazoline polymers (PIQ) were prepared, preferably by melt-condensation of AF-R-500 and AF-R-510 derived amines with various aromatic dicarboxylic acid derivatives (phenyl esters). Typical preparation of the AF-R-500 monomer involved thermal condensation of phenyl anthranilate and diaminobenzidine. Subsequent thermal reaction of this bis-orthoaminophenyl bibenzimidazole or its oxygenated (AF-R-510) ANALOGUE WITH SUCH ESTERS AS DIPHENYL OXYBIBENZOATE WERE CARRIED OUT. The prepolymers were then fabricated into glass- cloth-reinforced laminates using hot melt prepregging techniques. The laminates were cured, and generally postcured, under a variety of conditions to evaluate thermal and environmental effects in flexural strength and modulus. Varying degrees of thermoplasticity in the resin systems was observed with initial exposures to elevated temperatures. The composites displayed performance generally superior to any other known polymer system, with respect to retention of flexural strength (and flex modulus) upon prolonged exposure to 600 degrees F, as well as to 700 degrees F, and short exposure to 1000 degrees F. (Author, modified-PL)
Document Details
- Document Type
- Technical Report
- Publication Date
- Oct 01, 1969
- Accession Number
- AD0863759
Entities
People
- Beatrix Y. Sanders
- Harold H. Levine
- Walter P. Fitzgerald Jr.