Asymmetrical Microstrip IC Structures.
Abstract
Analytical and experimental results on microstrip and double ground plane symmetrical and asymmetrical microwave integrated circuits are presented. The results are aimed at developing a unique three-dimensional microwave integrated circuit coupler having greater than a two-octave bandwidth. Although similar in configuration to microstrip overlay couplers, a substantial volume saving is projected by moving the top ground plane to within 25 to 100 mils of the dielectric substrate surface. The top ground plane interaction is included through the use of computer-aided designs. Analytical results and measurements show the transmission system has many similarities to conventional microstrip and some notable differences. The microwave system described represents a modification of an earlier approach in which a space saving was projected through the use of mirror image dielectric substrates to combine the advantages of IC technology with the symmetrical field patterns typical of strip line non-IC technology. (Author)
Document Details
- Document Type
- Technical Report
- Publication Date
- Nov 14, 1969
- Accession Number
- AD0863956
Entities
People
- Donald Priebe
- Frederick R. Domer
- James P. Dietz
- Wilbert L. Beebe
- Yu Chang
Organizations
- General Electric