UHF Film Integrated Circuits.
Abstract
The purpose of this project is to investigate lumped-element versus microstrip circuitry for use (1) at microwave frequencies (up to X-band), (2) with high-power active devices, and (3) as transforming networks between radically different impedances. (a) Materials and Technology: A study of chrome-copper circuitry shows no measurable increase in rf resistivity when test circuits were subjected to 16 hours at 475 C densification temperatures. (b) Measurements: Capacitors have been measured at frequencies up to X-band. The Q's of 0.4-pF capacitors fabricated according to the latest procedures show values over 200, but decrease to 100 at X-band. The dielectric Q's are estimated to be approx 500, which is the same as the 1- to 2-GHz value. (c) Lumped-element Hybrids: The performance of the quadrature hybrid shows that it does not split power equally. The problem is attributed to losses and parasitic grounds detuning the circuits. (d) Lumped-element Amplifiers: Many 1-W amplifiers have been assembled using new lumped-element tuning circuits and over 9 dB of gain was achieved at 2.25 GHz. Studies have been made of the tuning range and losses of the input and output networks. The losses are less than 0.4 dB, higher than expected, and are attributed to the parasitic grounds around the inductors. Methods for computing the effect of these grounds have been developed and the results have checked with inductance measurements. (e) Distributed Circuits: The losses of coplanar waveguides have been studied and Q's of the order of those of microstrip have been measured for frequencies up to 10 GHz.
Document Details
- Document Type
- Technical Report
- Publication Date
- Dec 01, 1969
- Accession Number
- AD0864090
Entities
People
- Chang P. Wen
- John J. Hughes
- Martin Caulton
- Robert E. Debrecht
- Stanley P. Knight
Organizations
- Sarnoff Corporation